SEIKOH GIKEN XF5D Polishing film uses silicon dioxide as the abrasive material and has a diameter of 5 in.

The abrasiveness of polishing film products is graded on the Micron scale; the polishing film disc has a grade of 0.02 Micron.

Features
• Smooth polishing with minimum scratches
• Designed to provide GR-326 endface geometry 
• Stable fiber height over use of film life
• Ideal for APC & UPC quality polishes 
• Easily achieve cost reduction

• UPC level polishing result

• No binder contamination on fiber endface

• Fiber Height after polish goes between +20nm and -20nm, this leads to ultra RL performance

Precautions
For polishing liquid. please use deionized water, purified water, distilled water and RO water (no electrolytes). Use of water containing electrolytes may cause silica residue contamination on the fiber endface. SG recommends using water with an electrical conductivity of 50µS/cm or less. Store in a climate controlled environment. Avoid direct sun light; Temp: 10-30°C, RH: 30% to 70%.